As the physical limits of silicon threaten to stall Moore’s Law, advanced packaging has become the vital solution for continued innovation across high-performance technologies. Traditional packaging materials like epoxies and polyimides are too polar to meet the demands of next-generation devices. XLYNX’s proprietary fluorine-free crosslinker, BondLynx, enables the use of nonpolar, intrinsically low-loss resins – materials that are normally impossible to cure – to become stable, high-performance thermosets. These well-cured, low-dielectric materials preserve critical signal integrity, unlocking the full potential of advanced architectures like 2.5D, 3D-IC, and glass-core substrates.

Beyond the chip, XLYNX is transforming the assembly of high-value consumer devices through its covalent priming solutions. Modern industrial design increasingly relies on low surface energy plastics and specialty polymers for their durability and weight, yet these materials frequently resist traditional adhesives and overmolding processes. XLYNX’s suite of molecular crosslinkers creates permanent, covalent bonds on these challenging surfaces without the need for aggressive treatments. By bridging the gap between dissimilar materials, the XLYNX technology enables superior adhesion and delamination reduction for next-gen wearables, medical devices, and other premium electronics.

The round was led by Ross Mitchell, formerly Vice President of Broadcom Corporation, with participation from other strategic investors. “We are thrilled to partner with XLYNX Materials and support their mission to revolutionize the semiconductor advanced packaging market. Their technology has the potential to solve critical production challenges today and enable future low-dielectric advanced AI chip designs. We believe Robert Niven is the ideal leader to drive this vision forward.”

Robert Niven brings a wealth of experience in commercialization and scaling technology companies, having served as the Founder and CEO of CarbonCure Technologies. Mr. Niven stated, “I am excited to join XLYNX Materials at this pivotal moment to tackle some of the biggest technical and sustainability challenges facing the electronics industry. This funding validates our vision to move beyond traditional chemistry. Through joint development with over 50 industry partners, we are enabling the next generation of AI/6G hardware and elimination of fluorinated forever chemicals from its supply chain. The company’s innovations are truly groundbreaking, and I look forward to working with the talented team, customers and shareholders to expand our market reach and deliver transformative advancements for the semiconductor industry. The funding will be crucial in building the team, expanding our production capabilities and accelerating our go-to-market strategy.”

As part of the executive team changes, co-founder and former CEO, Dr. Jeremy Wulff, will focus on leading the company’s intellectual property development, industry partnerships and scientific discovery. Dr. Stefania Musolino is promoted to Director of Technology, and Sean Bourquin, President, will be departing to pursue other commercial interests. 

“Building XLYNX Materials from the ground up has been an incredible journey, and I am proud of the foundation that we’ve established through the hard work of our outstanding team.” said Dr. Wulff. “With the backing of our new investors, commercialization advancements and Rob’s proven leadership, XLYNX is poised for its next phase of commercial growth.”

About XLYNX Materials

XLYNX Materials is a specialty chemicals company that produces diazirine crosslinking solutions for advanced manufacturing. Founded in 2019 and headquartered in Victoria, BC, Canada, we develop crosslinkers and primers that redefine material properties. With a commitment to scientific excellence and industry collaboration, we help customers solve their most complex challenges, empowering the next generation of high-performance materials.

Media Relations

Email: info@xlynxmaterials.com

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We are proud to have participated in the Plug and Play Japan innovation event. This strategic engagement positions us at the heart of Asia’s most dynamic startup ecosystem, a crucial hub for emerging technologies and market expansion. Plug and Play Japan is renowned for connecting leading corporations with a global network of startups to drive collaborative innovation. By aligning ourselves with this platform, we are actively seeking out cutting-edge technologies and novel applications for our advanced materials. Our goal is to leverage this partnership to accelerate the development of next-generation microelectronics, from advanced packaging to flexible and wearable devices. We look forward to working with forward-thinking companies to solve complex technical challenges and create new market opportunities. Do you have a novel application in mind? Reach out to collaborate through this exciting journey!

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The global push to eliminate Per- and Polyfluoroalkyl Substances (PFAS) from manufacturing processes presents a significant challenge for the electronics industry. While PFAS have offered unique properties, their environmental persistence and health concerns necessitate their replacement. However, finding high-performance alternatives without compromising critical material characteristics has been difficult. XLYNX Materials offers a clear solution. Our diazirine crosslinking technology provides a robust, high-performance pathway to truly PFAS-free and halogen-free electronic materials. We enable the development of adhesives, dielectrics, and encapsulants that not only meet stringent environmental regulations but also maintain or even surpass the performance benchmarks of their PFAS-containing predecessors. This allows you to future-proof your designs and contribute to a more sustainable electronics ecosystem.

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Our latest innovation enables low-loss, high-reliability thermosets using inert hydrocarbon polymers like poly(HNB)—previously considered “unusable” due to their chemical inertness. With our diazirine crosslinkers, we’ve unlocked ultra-low dielectric constants (Dk < 2.3) and dissipation factors (Df < 0.001) at 10 GHz—perfect for advanced PCBs, CCLs, and semiconductor packaging. To learn more about our solutions for the semiconductor industry, check out our website. You can also find this article and other valuable resources there.

We’re Growing, Join Our Team: Senior Business Development – Semiconductor Segment

We’re seeking a highly accomplished and self-driven Senior Business Development professional to expand our reach in the semiconductor industry. This remote role requires 10+ years of business development experience in the semiconductor sector, a technical degree, and a proven ability to build strategic customer relationships with IDMs, fabless chip designers, and raw materials suppliers globally. You will be instrumental in developing new business opportunities, providing market feedback to R&D, and representing XLYNX at industry events, all while influencing the company’s commercial strategy and success.

Apply today to join us at the forefront of next-generation semiconductor materials! Know a friend who might be a fit? Share the word!

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Stronger Bonds Where It Matters Most: Adhesion Innovations for Polyolefins For manufacturers in electronics and CASE industries, reliable adhesion to polyolefin substrates like UHMWPE and HDPE has long been a barrier to innovation. Whether in wearable devices, conformal coatings, structural adhesives, or specialty sealants, surface preparation challenges often limit material choice and performance. At XLYNX Materials, we’re changing that. In our latest round of peel adhesion testing, PXN-2006 and BXW-202—two of our diazirine-based crosslinkers—delivered significant performance gains in 180° peel strength on polyolefin surfaces. Using ASTM D903 test methodology, UHMWPE films were bonded to HDPE boards with both epoxy and polyurethane adhesives. Across both adhesive systems, primed surfaces outperformed non-primed samples by a substantial margin. Our best-performing system to date, PlastiLynx, reached ~12N/25.4mm in peel strength—an impressive benchmark given the notoriously poor adhesion profile of polyolefins. These results are from preliminary validations, with additional optimizations in process that are expected to drive performance even higher. While the current dataset includes two adhesive chemistries, expanded testing is underway to validate performance across additional systems. Early indicators strongly support broad applicability—particularly in electronics assembly and CASE formulations where polyolefins offer mechanical and chemical advantages but have historically posed adhesion difficulties. For formulators and product engineers seeking to enable new design possibilities without compromising bond integrity, XLYNX crosslinking primers offer a simple, scalable solution. If you’re working with polyolefins in coatings, encapsulants, sealants, or structural adhesives, reach out to our technical team. Let’s explore how PlastiLynx PXN-2006, or BXW-202 can enhance surface functionality and deliver adhesion performance you can count on. Contact Us

PXN-2006: Advanced Adhesion at a Lower Cost In line with our goal of enabling innovation, PXN-2006, a universal primer engineered to improve adhesion on UHMWPE, HDPE, and other low-surface-energy substrates is now available at a lower cost. This offering presents a strategic opportunity to incorporate advanced crosslinking technology into your system design. Connect with us to discuss your applications and request samples, datasheets, or a tailored quote. Let’s explore how PXN-2006 can enhance your formulation strategy. Contact Us

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Quantum dots play a crucial role in next-generation technologies, from ultra-high-definition full-color displays to hyperspectral imaging systems. However, conventional photolithography disrupts their delicate surface chemistry, limiting optical and electronic performance. XLYNX’s diazirine-based crosslinkers introduce a precise, air-stable, and scalable solution that eliminates the need for traditional photoresists and etchants, ensuring seamless integration with standard photolithography processes.

Unlike conventional methods that compromise QD integrity, XLYNX’s innovative crosslinkers enable non-destructive patterning, preserving the properties of heavy metal-free InP/ZnSe/ZnS quantum dots under ambient conditions. This breakthrough allows for high-resolution imaging with precision exceeding 13,000 pixels per inch (ppi), while simultaneously enhancing device performance—achieving peak external quantum efficiency (EQE) of 15.3% and a maximum luminance of approximately 40,000 cd/m².

Beyond performance improvements, XLYNX’s approach aligns with the growing demand for sustainable manufacturing. By eliminating the need for toxic photoresists and etchants, this technology significantly reduces environmental impact while maintaining compatibility with existing industrial workflows.

With applications spanning multiple industries, XLYNX’s photopatterning technology is poised to drive innovation in high-performance QLED, OLED, and microLED displays, flexible electronics such as foldable screens and wearable devices, and photonics-based technologies including quantum dot lasers and sensors. As an eco-friendly alternative to traditional lithography, it offers a scalable and industry-ready solution for next-generation electronic and optoelectronic devices.

To learn more about the electronically-optimized diazirine crosslinking technology developed by XLYNX Materials, contact us at info@xlynxmaterials.com. Sample-sized quantities of BondLynx and PlastiLynx are available to ship, and our team is standing by to assist with your questions and trials. 

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To preserve high-speed, low-loss signal transmissions and eliminate crosstalk in printed circuit board designs, low dielectric constant and dissipation factors are essential for the materials being used. In addition, these materials must have excellent thermal and mechanical stability, and be able to withstand harsh environmental conditions. Finally, printed circuit board materials must be able to adhere to reinforcement substrates like copper clad laminates and be receptive to modern photopatterning and photolithography applications. 

Polymers like polynorbornene are recognized as having the low dielectric properties and thermomechanical stability required for printed circuit boards, but lack the functional groups necessary for adhesion and photopatterning. To add functionality to these materials without negatively impacting their dielectric properties, researchers have been collaborating with XLYNX Materials to develop crosslinked polynorbornenes that are optimized for printed circuit board applications. The encouraging results of this study are now published in Macromolecular Rapid Communications, a scientific journal of the Wiley-VCH (click here to view). 

Top-down SEM images of photopatterning results on BondLynx-crosslinked poly(HNB) to leave pillars and holes (see 10 micrometer scale for reference)

In this study, BondLynx was combined with a non-functionalized polymer known as vinyl-addition polynorbornene, or poly(HNB). The resulting crosslinked poly(HNB) demonstrated positive results in negative tone photopatterning and copper clad laminate adhesion tests, while also demonstrating high dielectric performance reliability under heat and humidity testing. Most importantly, this technique preserved the dielectric constant and dissipation properties of the material within acceptable thresholds. 

The results of this research demonstrate how functionality can be added to virtually any thermoset or thermoplastic polymer through the use of diazirine crosslinkers without negatively affecting dielectric properties. While this research was focused on printed circuit board applications, these findings have broader implications for advanced microelectronic and semiconductor design in general. As noted by the study’s authors, this also creates new opportunities for advanced printed circuit board applications, such as fan-out wafer-level packaging. 

“It’s exciting to see how our diazirine crosslinking technology is enabling new opportunities in printed circuit board design,” remarked Dr. Stefania Musolino, R&D Manager at XLYNX Materials and contributing author to the study. “We look forward to working with manufacturers in this exciting field, as we believe our technology is uniquely suited to this demanding application.” 

To learn more about the electronically-optimized diazirine crosslinking technology developed by XLYNX Materials, contact us at info@xlynxmaterials.com. Sample-sized quantities of BondLynx are available to ship, and our team is standing by to assist with your questions and trials. 

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You can read the article “PFAS-Free Universal Primer for Low-Surface-Energy Polymers” for yourself on adhesivesmag.com, the monthly e-magazine from the Adhesives & Sealants Industry (ASI). The article describes the science behind our diazirine crosslinking technology, how PlastiLynx PXN is used, and the unique advantages that our universal primer offers to advanced manufacturers.

Thanks to ASI for their continued interest and support. We are grateful for the opportunity to spread the word about the exciting work we’re doing and appreciate the interest this article has generated.

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Solaires is a cleantech company that develops unique perovskite-based solar technology specifically tuned to harness the bandgap of electric indoor light. Indoor photovoltaics are the next step in the evolution of conventional battery-operated indoor electronic devices, and the market for this technology is entering a period of rapid growth. Already in 2024, Solaires has announced plans for a new Langford-based production facility to manufacture indoor perovskite photovoltaic modules, and a partnership with Shanghai-based Genesis Technologies to mass-produce a perovskite solar alternative to traditional batteries for indoor electronic devices.

Compared to traditional silicon technology, perovskite solar modules are cheaper, easier, and more sustainable to manufacture. They can be printed over flexible surfaces and integrated into transparent applications, allowing the technology to be seamlessly incorporated into the design of structures, vehicles and other power-consuming devices. Importantly, it also has a tunable bandgap, which means that perovskite can be adjusted to different wavelengths of light. While there is a lot to get excited about when it comes to perovskite solar, one of the biggest challenges with this technology is that it can degrade with time – especially when exposed to external stimuli like UV light and heat. This is where XLYNX Materials comes into the picture.

Our molecular bonding agent, BondLynx, has proven to be a highly effective stabilizing agent for perovskite, significantly improving the efficiency and long-term performance of perovskite solar cells in a recent study. With the release of this study, XLYNX has been keen to work with innovative perovskite solar companies to commercially validate this application. As a result, we were thrilled to find a neighbor like Solaires Enterprises who is already a pioneer in this field.

Encouraged by the results of initial validation tests with the Solaires technology, the two companies are now exploring opportunities to incorporate crosslinking technology into the design of perovskite-based modules. If successful, this combination of know-how and cutting-edge technologies could be a real game changer in the perovskite solar sector. By adding stability and improving long-term performance, XLYNX Materials hopes to play a key role in the long-term viability and commercial success of this important source of clean energy.

About Solaires Entreprises Inc.

Founded in Victoria, BC, Solaires is pioneering the research and development of the next generation of solar cells. Solaires’ key innovation is their perovskite-based PVModules that, unlike traditional materials, can generate electricity from both indoor and outdoor light. Solaires is one of the first companies to market PVModules for small, light, and flexible indoor applications. These modules are half the price, yield 2x better performance, and generate 50% less greenhouse gas emissions than conventional modules. Solaires is developing a wireless solution to charging IoT devices with an inexpensive and easy to print solar module that is revolutionizing the industry.

About XLYNX Materials Inc. 

XLYNX Materials is an innovative chemtech company located in Victoria, BC, Canada, specializing in diazirine crosslinker adhesives, primers, and surface treatment solutions for low surface energy plastics like polypropylene and polyethylene. XLYNX is the global leader in materials-based diazirine crosslinking and is working with industry leaders and innovative researchers from around the world to address long-standing material adhesion, stability, and strengthening challenges. The company’s diazirine crosslinking technology has been published in numerous peer-reviewed academic journals, including Science, and the company was recently awarded a 2023 Innovation Award by the Adhesive and Sealant Council (ASC), joining past winners that include DuPont, Dow, PPG, and Avery Dennison.

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