We are pleased to share important progress regarding the commercial availability of a select category of our advanced molecular reagents in the United States. We’ve recently received a Low Volume Exemption (LVE) approval from the U.S. Environmental Protection Agency (EPA), allowing us to import significant quantities of one of our reagents for use by a valued early-adopter customer.

This is a critical step that allows us to further support our customers for commercial applications of these specific reagents in the US. We’re excited about the possibilities this opens up and look forward to continuing to meet the needs of our partners.

Understanding the EPA’s Low Volume Exemption (LVE) Program

To provide context on this milestone, it’s helpful to understand the purpose and parameters of the EPA’s Low Volume Exemption program, established under the Toxic Substances Control Act (TSCA).

The LVE program is designed to facilitate the commercial introduction of certain new chemical substances that are produced or imported in moderate quantities (up to 10,000 kg per year), while still ensuring rigorous environmental and public health protection.

Key Features of an LVE:

• Volume Threshold: The LVE approval enables us to align exactly with our customers’ supply chain requirements. This volume enables the support of initial commercial adoption and integration into high value applications by our partners.
• Accelerated Market Entry: By meeting the strict LVE criteria, the regulatory review period is significantly streamlined compared to full Pre-Manufacture Notice (PMN) submissions. This accelerates our ability to move advanced materials from successful R&D qualification directly into our customers’ commercial production channels.
• Excellent Option for Formulation Additives: In many cases, XLYNX’s reagents are used as crosslinking additives in resin formulations. Loading levels typically range from 1–15 weight percent, meaning that 1000 kg of imported crosslinker reagent will enable the production of 10,000 kg or more of product for our customer. The volume threshold in the LVE program provides a great option for importing materials in these types of use-cases. 

The Path Forward

This LVE approval is an important commercial green light that enables our partners to transition smoothly from proof-of-concept to product launch using our advanced reagents in the US market.

We remain committed to supporting our partners through every stage of adoption and look forward to strengthening those relationships as we move together toward full market integration for these specialized materials.

For more information on the commercial availability of our advanced products, please contact your XLYNX technical representative.

The post XLYNX Materials Secures US EPA Low Volume Exemption appeared first on XLYNX Materials.

At XLYNX Materials, our mission is to provide the next generation of high-performance, sustainable chemistry that solves the microelectronics industry’s most persistent material trade-offs. We are excited to announce two major milestones this quarter that directly accelerate the commercial adoption and technical versatility of our advanced reagents, particularly the BondLynx™ family of crosslinkers.

XLYNX Reagents Receive EPA Low-Volume Exemption

We’re please to share that we’ve recently received a low-volume exemption approval (LVE) from the US EPA for a select category of our advanced reagents. This exemption allows us to further support our customers for commercial applications of these products in the US. We’re excited about the possibility this opens up and look forward to continuing to meet the needs of our partners.

Expanding the Performance Envelope – Patterning of Conductive Polymers

Approximately six months ago, XLYNX Materials’ focus was primarily concentrated on developing crosslinking solutions for the broader Coatings, Adhesives, Sealants, and Elastomers (CASE) markets. While our successes there continue, we have made significant internal progress in applying our unique C-H insertion chemistry to the highly specialized field of microelectronics fabrication.

This progress culminated in a major internal R&D breakthrough: successful direct photopatterning of a non-photosensitive conductive polymer on an unmodified silicon wafer.

The Technical Achievement (Using BXW-202):

The ability to directly pattern functional materials (like conductive polymers) onto common semiconductor substrates is a key step toward enabling next-generation printed and flexible electronics.

Our team used our core crosslinking reagent, BXW-202, to photosensitize a polymer that inherently lacked any functional groups for lithography. This process bypasses the complex pre-functionalization steps typically required in formulation and demonstrates the unique versatility of our technology.

The Implications for Microelectronics:

• Enabling New Conductive Materials: This success proves that BondLynx™ can transform materials previously confined to basic coating applications into lithographically capable layers. It offers a new pathway for formulating complex devices like flexible circuits and sensors using novel conductive inks and materials.
• Simplified Manufacturing: By achieving direct patterning on an unmodified wafer, we eliminate intermediate steps (like surface plasma treatments or dedicated adhesion layers). This simplification is critical for improving yield and reducing manufacturing costs in high-volume production of advanced microdevices.

This breakthrough affirms that our core chemistry provides the robust foundation needed not only to solve traditional material performance trade-offs but also to fundamentally simplify and expand the manufacturing toolkit for the flexible and printed electronics industry.

The post Commercial Green Light & Advanced Patterning Breakthrough appeared first on XLYNX Materials.

The post Takeaways from SEMICON West 2025 appeared first on XLYNX Materials.

SEMICON West in Phoenix was a hub of innovation. The XLYNX team spent three days engaging in conversations that confirmed a pivotal shift in the microelectronics industry. It was clear that the next generation of technical challenges requires a fundamental change in materials, and we were there to show how our technology is leading that change.

A key takeaway is that the industry’s transition from electronics to photonics requires new materials that reduce loss and energy consumption. While many companies are hesitant to disrupt their current material strategies, the challenges they face have no clear solutions by simply innovating on what they are doing now.

Our presence at the event highlighted how we are an enabler of these necessary disruptive materials. Our R&D Manager’s presentation on “Enhancing Flexible Hybrid Electronics Through Diazirine-Based Surface Bonding Technologies“ was well-attended and positioned our chemistry as a concrete solution to longstanding adhesion challenges. Our CEO also pitched in the SEMI Startups for Sustainable Semiconductors competition, effectively conveying the performance and sustainability value of our technology and reinforcing that we enable the industry’s move toward PFAS-free solutions.

Join the Disruption

XLYNX is hiring a VP of Sales. Join a winning team, apply at careers@xlynxmaterials.com today!

We’re looking for an ambitious, highly-networked VP of Sales – Semiconductor Materials to drive the commercial adoption of our diazirine-based crosslinkers.

XLYNX Materials is the global leader in this disruptive chemtech, enabling solutions for next-generation advanced packaging and flexible electronics. If you’re ready for a high-impact role selling truly new materials into the semiconductor market, this is your chance.

The Opportunity

The industry urgently needs solutions for challenges like warpage, ultra-low Dk/ Df, and the shift to PFAS-free manufacturing. Our technology offers a unique competitive edge by enabling the crosslinking of critical low-dielectric polymers.

You will play a direct role in our strategy by:

• Driving Revenue: Owning the full sales cycle and expanding relationships with IDMs, fabless designers, and resin suppliers.
• Providing Technical Sales: Articulating the value of our materials to highly technical customers.

Key Requirements

• 10+ years of proven success in a technical sales/ business development role within the semiconductor materials industry.
• Proven track record of transitioning markets toward disruptive technologies.
• Technical Degree (BSc minimum) in Materials Science, Chemistry, or Engineering.
• Location: Remote with travel (West Coast US/ Canada or Japan).
• Compensation: From $150K per year (potential for stock options).

Ready to influence the future of microelectronics?

To apply, please email your resume and cover letter to careers@xlynxmaterials.com.

XLYNX Materials Inc. | Driving disruptive advancements in next-generation microelectronics.

The post Semicon West & XLYNX Materials appeared first on XLYNX Materials.

We’ll be at SEMICON West from October 7th-9th and would love the opportunity to connect in person.

If you’re attending, reply now so we can arrange a time to meet.

I also encourage you to attend our presentation on Tuesday, October 7, at 10:35 am (MT). Dr. Stefania Musolino, our R&D Manager, will be speaking on “Enhancing Flexible Hybrid Electronics Through Diazirine-Based Surface Bonding Technologies”. Click here to learn more.

We are honoured to be a finalist for Semi’s Startups for Sustainable Semiconductors. Our CEO, Dr. Jeremy Wulff, will be speaking about our exciting innovations.

Don’t miss out! We look forward to seeing you in Phoenix!

The post Semicon West – Let’s Connect! appeared first on XLYNX Materials.

The post Finalist – S3 Initiative @ Semicon West appeared first on XLYNX Materials.

We are proud to have participated in the Plug and Play Japan innovation event. This strategic engagement positions us at the heart of Asia’s most dynamic startup ecosystem, a crucial hub for emerging technologies and market expansion. Plug and Play Japan is renowned for connecting leading corporations with a global network of startups to drive collaborative innovation. By aligning ourselves with this platform, we are actively seeking out cutting-edge technologies and novel applications for our advanced materials. Our goal is to leverage this partnership to accelerate the development of next-generation microelectronics, from advanced packaging to flexible and wearable devices. We look forward to working with forward-thinking companies to solve complex technical challenges and create new market opportunities. Do you have a novel application in mind? Reach out to collaborate through this exciting journey!

The post Featured Speaker: Semicon West – Flexible/Hybrid Electronics appeared first on XLYNX Materials.

The global push to eliminate Per- and Polyfluoroalkyl Substances (PFAS) from manufacturing processes presents a significant challenge for the electronics industry. While PFAS have offered unique properties, their environmental persistence and health concerns necessitate their replacement. However, finding high-performance alternatives without compromising critical material characteristics has been difficult. XLYNX Materials offers a clear solution. Our diazirine crosslinking technology provides a robust, high-performance pathway to truly PFAS-free and halogen-free electronic materials. We enable the development of adhesives, dielectrics, and encapsulants that not only meet stringent environmental regulations but also maintain or even surpass the performance benchmarks of their PFAS-containing predecessors. This allows you to future-proof your designs and contribute to a more sustainable electronics ecosystem.

The post Named Semi S3 2025 Semi-Finalist appeared first on XLYNX Materials.

Our latest innovation enables low-loss, high-reliability thermosets using inert hydrocarbon polymers like poly(HNB)—previously considered “unusable” due to their chemical inertness. With our diazirine crosslinkers, we’ve unlocked ultra-low dielectric constants (Dk < 2.3) and dissipation factors (Df < 0.001) at 10 GHz—perfect for advanced PCBs, CCLs, and semiconductor packaging. To learn more about our solutions for the semiconductor industry, check out our website. You can also find this article and other valuable resources there.

We’re Growing, Join Our Team: Senior Business Development – Semiconductor Segment

We’re seeking a highly accomplished and self-driven Senior Business Development professional to expand our reach in the semiconductor industry. This remote role requires 10+ years of business development experience in the semiconductor sector, a technical degree, and a proven ability to build strategic customer relationships with IDMs, fabless chip designers, and raw materials suppliers globally. You will be instrumental in developing new business opportunities, providing market feedback to R&D, and representing XLYNX at industry events, all while influencing the company’s commercial strategy and success.

Apply today to join us at the forefront of next-generation semiconductor materials! Know a friend who might be a fit? Share the word!

The post Unlocking the Future of High-Frequency Electronics appeared first on XLYNX Materials.

Stronger Bonds Where It Matters Most: Adhesion Innovations for Polyolefins For manufacturers in electronics and CASE industries, reliable adhesion to polyolefin substrates like UHMWPE and HDPE has long been a barrier to innovation. Whether in wearable devices, conformal coatings, structural adhesives, or specialty sealants, surface preparation challenges often limit material choice and performance. At XLYNX Materials, we’re changing that. In our latest round of peel adhesion testing, PXN-2006 and BXW-202—two of our diazirine-based crosslinkers—delivered significant performance gains in 180° peel strength on polyolefin surfaces. Using ASTM D903 test methodology, UHMWPE films were bonded to HDPE boards with both epoxy and polyurethane adhesives. Across both adhesive systems, primed surfaces outperformed non-primed samples by a substantial margin. Our best-performing system to date, PlastiLynx, reached ~12N/25.4mm in peel strength—an impressive benchmark given the notoriously poor adhesion profile of polyolefins. These results are from preliminary validations, with additional optimizations in process that are expected to drive performance even higher. While the current dataset includes two adhesive chemistries, expanded testing is underway to validate performance across additional systems. Early indicators strongly support broad applicability—particularly in electronics assembly and CASE formulations where polyolefins offer mechanical and chemical advantages but have historically posed adhesion difficulties. For formulators and product engineers seeking to enable new design possibilities without compromising bond integrity, XLYNX crosslinking primers offer a simple, scalable solution. If you’re working with polyolefins in coatings, encapsulants, sealants, or structural adhesives, reach out to our technical team. Let’s explore how PlastiLynx PXN-2006, or BXW-202 can enhance surface functionality and deliver adhesion performance you can count on. Contact Us

PXN-2006: Advanced Adhesion at a Lower Cost In line with our goal of enabling innovation, PXN-2006, a universal primer engineered to improve adhesion on UHMWPE, HDPE, and other low-surface-energy substrates is now available at a lower cost. This offering presents a strategic opportunity to incorporate advanced crosslinking technology into your system design. Connect with us to discuss your applications and request samples, datasheets, or a tailored quote. Let’s explore how PXN-2006 can enhance your formulation strategy. Contact Us

The post PXN-2006: Advanced Adhesion at a Lower Cost appeared first on XLYNX Materials.