The Evolving Semiconductor Landscape

The complexity of semiconductor packaging is accelerating with the demand for faster, smaller, and more powerful microelectronics. XLYNX Materials provides innovative molecular crosslinkers and materials that are redefining performance, reliability, and manufacturability. Our technology enables the creation of next-generation materials, from low-loss dielectrics that are crucial for high-speed signal integrity to advanced photopatterning that facilitates high-density circuit designs.

Meeting the demands of modern semiconductor technology is challenging for traditional materials and methods. Incumbent epoxy-based technologies, for example, compromise electrical performance due to their reliance on polar groups for curing, resulting in high dielectric constant (D_k) and dissipation factor (D_f). Furthermore, many ultra-low D_k/D_f materials, like cyclic olefin polymers (COPs), are thermoplastics that lack the chemical functional groups needed for traditional curing reactions. This leaves a critical gap between performance requirements and material capabilities.

We have a proven track record of helping customers overcome these challenges. Our innovative materials enable superior signal integrity in high-frequency applications (5G, RF, high-speed digital) by delivering ultra-low D_k and D_f. We’ve successfully achieved the markets aspirational goals of D_k < 2.4 and D_f < 15×10⁻⁴ at 10 GHz with fluorine-free products, providing a clear path to high-performance electrical design without the compromises of conventional materials.

Poor adhesion is a root cause of critical semiconductor failures like blistering and layer delamination. Traditional adhesives and molding compounds often struggle with ensuring robust adhesion to the various substrates used in modern semiconductor packaging. Our products enhance adhesion for dielectric fillers (reducing intralaminar delamination) and for resin/ conductor interfaces (reducing interlaminar delamination). XLYNX offers up to 900% greater adhesion than leading adhesives/ primers on dissimilar substrates.

Semiconductors must withstand significant mechanical and thermal stresses throughout their lifespan. XLYNX Materials provides products that significantly improve properties like tensile strength, bend strength, and overall material stability, strengthening response to mechanical stress and enhancing reliability. Through covalent crosslinking, our materials contribute to optimized Coefficient of Thermal Expansion (CTE) and increased Glass Transition Temperature (T_g).

Developing semiconductors is challenging, as their manufacturing requires materials that are easy to process and integrate. Many advanced polymers are thermoplastics that lack the functional groups needed for traditional curing reactions, making them difficult to use. Our products are a drop-in additive, so no retooling is required. We enable next-gen manufacturing with current infrastructure by allowing for negative-tone photopatterning of these materials, leading to efficient processes like low-temperature curing for sensitive substrates and advanced additive manufacturing methods.

We offer solutions across a broad range of semiconductor applications, including:

• Low-Loss Thin Films: Our technology enables the crosslinking of resins to create well-cured thermosets that maintain a low dielectric constant (D_k) and dissipation factor (D_f) for high-speed signal integrity; excellent for redistribution layers and underfill.
• Molding Compounds & Encapsulants: We enhance the performance and long-term reliability of molding compounds and encapsulants by creating robust thermoset materials with improved thermal stability and mechanical strength.
• Thermal Insulation Materials: We enable the creation of durable thermal insulation materials by transforming thermoplastics into thermosets, improving high-temperature performance and resistance to thermal expansion and creep.
• Adhesion Promotion: Our products form strong, permanent covalent bonds; which is a game-changer for reliable adhesion to materials that traditionally lack functional groups.

Our technology provides a competitive advantage by enabling the use of materials that are traditionally difficult to cure. We empower manufacturers to optimize key properties like the coefficient of thermal expansion (CTE), Young’s modulus, and moisture absorption, ensuring unmatched performance and reliability in the most demanding applications.