SEMICON West in Phoenix was a hub of innovation, and we were thrilled to be at the heart of it. The XLYNX team spent three days immersed in conversations about the future of microelectronics, from the exhibit floor to the speaker stage. It was clear that the industry is at a pivotal point, and the discussions our team had reinforced that new materials, such as BondLynx, are essential to solving the next generation of technical challenges.
Here’s a look at what we saw, what we heard, and what we learned.
What We Saw and Heard on the Floor
The show had a strong and unmistakable focus on the industry coming together to innovate. The challenges of next-generation semiconductors are immense, from processes to sustainability and material development. Discussions frequently centered around high-demand segments such as AI and automotive chips, and how new bonding and interconnect solutions through heterogeneous integration will be key. Interestingly, our diazirine chemistry is a natural fit in these applications, allowing for new, sustainable materials and processes to be developed.
From a business development perspective, it was clear that our customers are focused on improving the efficiency of chips for data centers and AI accelerators. This push for higher-density IC packaging is causing real issues with today’s materials, including crack formation, warpage, and the need for reduced CTE and Df. A key theme was the transition from electronics to photonics to reduce loss and improve energy efficiency.
Our Technical Discussion on Flexible Electronics
Our R&D Manager, Dr. Stefania Musolino, presentation on “Enhancing Flexible Hybrid Electronics Through Diazirine-Based Surface Bonding Technologies” was well-attended and generated positive engagement from the audience. The talk positioned our diazirine surface bonding as a concrete solution to long-standing adhesion and processing challenges in flexible and hybrid substrates. The audience responded very well to the idea of enabling reliable, low-temperature, and photopatternable bonding methods for next-generation devices. For more insight, check out our flexible solutions.
Our CEO’s Pitch on Sustainable Semiconductors
A clear highlight of the event was our CEO, Dr. Jeremy Wulff, being a winner of the SEMI Startups for Sustainable Semiconductors competition. Jeremy effectively conveyed the sustainability and performance value of our technology, tying it into the industry’s broader push for greener, more adaptable semiconductor manufacturing. The feedback from the room suggested a real interest in how XLYNX’s chemistry can scale into critical application areas. This confirmed that the push for PFAS-free solutions is a part of the industry’s long-term roadmap, and we are an enabler of this transition.
Interested in learning more about our diazirine crosslinkers and their uses in semiconductors?
Check out our solutions today!
What We Learned from Our Meetings
In our one-on-one meetings, we saw strong curiosity from players across packaging, flexible electronics, and material development. A common theme was the need for ultra low loss advanced packaging that can solve adhesion and durability bottlenecks without adding complexity to process flows. The discussions reinforced that while there are real issues with today’s materials, there aren’t enough companies willing to disrupt them.
The key takeaway is this: the packaging challenges being faced today cannot be solved by simply innovating on the status quo. Companies need to look for novel, disruptive materials and processes. Our diazirine crosslinkers are directly aligned with these industry pain points and we are an enabler of these disruptive materials.
Are you ready to solve todays biggest challenges? Contact us to today!
