BondLynx (BXW-202) is a revolutionary PFAS- free small molecule bonding agent that takes advantage of chemical crosslinking to form strong covalent bonds between a wide range of low surface energy polymers. This makes it a highly effective adhesive for hard-to-bond polymer materials that can also be used in textile strengthening and composite additive applications. Combined with commercial adhesives, BondLynx can be used as a surface activating primer, and with its low dielectric constant properties, BondLynx is ideally suited to the semiconductor packaging sector and more broadly to the microelectronics industry for photopatterning and other applications. Finally, this bis-diazirine crosslinker is a remarkable stabilizing agent for organic components, perovskites, quantum dots, and circuits.

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